Albis Optoelectronics

Albis Optoelectronics (booth 3506) will present its extended portfolio of mounted photodiodes. In close cooperation with customers, Albis has developed complex assembly solutions that meet stringent requirements with regards to alignment precision, bandwidth and layout complexity. The Albis avalanche and pin photodiode portfolio can now be supplied as flip-chip bonded or wire-bonded devices on customised 2D or 3D (wrap-around) carriers. For example, PS20X4 consists of an array of four, flip-chip soldered 28Gb/s lensed photodiodes that can be used as the core building block inside a 100G receiver optical sub-assembly (ROSA) module. To support the surge in demand for its high-end products the company will be doubling its work force and production infrastructure during 2017.

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Systems vendors are using intelligent software to squeeze more performance from optical networks. Pauline Rigby reports on developments at OFC 2017