Albis Optoelectronics (booth 3506) will present its extended portfolio of mounted photodiodes. In close cooperation with customers, Albis has developed complex assembly solutions that meet stringent requirements with regards to alignment precision, bandwidth and layout complexity. The Albis avalanche and pin photodiode portfolio can now be supplied as flip-chip bonded or wire-bonded devices on customised 2D or 3D (wrap-around) carriers. For example, PS20X4 consists of an array of four, flip-chip soldered 28Gb/s lensed photodiodes that can be used as the core building block inside a 100G receiver optical sub-assembly (ROSA) module. To support the surge in demand for its high-end products the company will be doubling its work force and production infrastructure during 2017.
Oleg Khaykin, CEO of Viavi Solutions, speaks candidly to Fibre Systems about how to compete in the challenging world of communications test and measurement
Hao Dong describes how innovative optical fibres and cabling could provide substantial benefits for connecting data centres across a wide range of distances
Richard Ednay considers whether fibre characterisation needs to be modified to suit modern optical communication systems that are likely to include coherent transmission
ECOC is the place to be to discover the latest technological and commercial innovations in optical components and networks. Here we highlight some of the exhibitors and events taking place in the exhibition hall.