Components and Subsystems

PacketLight Networks has released the PL-4000M muxponder.

Hamamatsu Photonics has developed a semiconductor failure analysis system called the PHEMOS-X C15765-01 that in just a single unit uses visible to near-infrared light to analyse semiconductor defects.

Optoscribe has launched a monolithic glass chip for low-loss coupling to silicon photonics (SiPh) grating couplers.

Acacia Communications is sampling a new 100G coherent dense wavelength division multiplexing (DWDM) pluggable solution.

PacketLight Networks has released its PL-4000 product line of modular, cost-effective, 400G muxponder and transponders for data centre interconnect (DCI), high capacity metro, and long haul applications.

Component and connectivity solution provider, Go!Foton announced the launch of a new platform for AI-capable intelligent management of optical networks at the OFC Conference and Exhibition.

Component, module, and subsystem vendor, II‐VI introduced a new pluggable optical line subsystem (POLS) platform on its booth at OFC.

Optoscribe has launched OptoArray, its new range of precision fibre alignment structures.

Now available from Nokia is the Quillion family of chipsets that are designed to power next-generation massive scale access networks.