Components and Subsystems

Now available from Iskratel are two universal next-generation PON blades – the 8-port multi-PON blade and the 16-port GPON blade. The blades are designed to aid a lucrative and controlled upgrade to next-generation networks, such as NG-PON2 and XGS-PON.

The 8-port multi-PON blade simultaneously supports NG-PON2 and XGS-PON technologies, without the need to replace current PON infrastructure, whilst the NG-PON blade is flexible enough to allow operators to build on their existing GPON shelves, providing a pay-as-you-grow, gradual expansion to next-generation networks.

MaxLinear has introduced the Telluride family (MxL935XX) of 400Gb/s pulse-amplitude-modulation (PAM4) digital signal processing systems-on-chip devices to address the high-speed optical interconnect needs of mega-scale cloud and enterprise data centres.

APAT Optoelectronics Components (OE) has successfully developed the XGS-PON/XG-PON+GPON Combo OLT transceiver, which allows hybrid access for 10G PON applications. This approach allows carriers to achieve a smooth, scalable upgrade from GPON to XG-PON or XGS-PON.

Coherent optical module developer Acacia Communications has announced the general availability of its pluggable CFP2-DCO module supporting 100Gb/s and 200Gb/s transmission.

Acacia’s new module offers several programmable modulation formats: 100Gb/s transmission using QPSK modulation for metro-core and long-haul applications; and 200Gb/s for metro-access applications using either 16QAM for backward compatibility or 8QAM for greater reach and fewer regeneration stages.

GlobalFoundries has demonstrated a 112Gbps SerDes capability, which provides a building block for the next generation of silicon used in cloud computing, hyperscale data centre, and networking applications. Enabling 112G connectivity will allow customers to double chip bandwidth in their next generation products.

The 112G SerDes targets 25dB+ insertion loss for interconnects and can support several multi-level signalling schemes. Flexibility has been built into the design so that customers can analyse the effectiveness of a variety of forward error correction (FEC) schemes.

Finisar announced that it is in full production of its 100G shortwave wavelength division multiplexing (SWDM) optical transceiver, which is compliant with the 100G SWDM4 specification defined by the SWDM multi-source agreement (MSA).

The pluggable QSFP28 transceiver is the first mass-produced module capable of transmitting 100Gb/s over a pair of multimode fibres, thus enabling users to upgrade their systems from 10 Gigabit Ethernet to 100 Gigabit Ethernet without changing their data centre cabling.

Champion ONE, a supplier of standards-based compatible transceivers, has announced general availability of its new 2.5Gb/s bidirectional (bi-di) coarse wavelength division multiplexing (CWDM) SFP hot-pluggable transceivers.

This new transceiver supports SONET OC-48, 2G Fibre Channel, 2.4G Common Public Radio Interface (CPRI), and Gigabit Ethernet. For CPRI applications, the bi-di transceiver can support an operating temperature range of -40°C to 85°C.

At ECOC 2017 in Sweden, Oclaro unveiled photonic integrated coherent transmitters (ICTs) and intradyne coherent receiver (ICRs) that enable optical transmission speeds up to 600Gb/s. Both products support baud rates up to 64Gbaud and complex modulation schemes up to 64-QAM.

These high-performance components can be configured for data rates from 100Gb/s to 600Gb/s, enabling customers to build modules supporting a variety of network applications from data centre interconnect (DCI) to ultra-long-haul transmission.

Semiconductor developer Inphi is sampling the M200, an ultra-low power and high-performance digital signal processor (DSP) supporting 100G and 200G data rates for coherent optical modules.

The M200 is the first member of Inphi’s 16nm LightSpeed-III family of SoC devices, from the company’s acquisition of ClariPhy.

HiLight Semiconductor has announced the production release of the HLR10G1, a 11.3Gb/s CMOS transimpedance amplifier (TIA) designed to provide best-in-class sensitivity when used with 10Gb/s avalanche photodiodes (APDs).

Manufactured on 12-inch wafers, the HLR10G1 is ideally positioned to meet the high-volume, low-cost, high-performance requirements of the 10G PON market, which should start to ramp in 2017, the company contends.