ADVA has launched the ADVA FSP 150-GO102Pro Series, a cell gateway device that has been specifically engineered for installation in even the most challenging locations, to enable the easy deployment of small cells at street level.
Infinera has enhanced the open line system (OLS) capabilities of the Infinera Groove G30 Network disaggregation platform.
ATX’s next-generation optical node has been launched to enable multiple system operators to start capitalising on the capabilities of Distributed Access Architecture (DAA) and digital technologies.
Intel has expanded its PON portfolio with the introduction of a high-speed, multimode 10G PON chipset, which was showcased at the Broadband World Forum event in Berlin.
The American Institute for Manufacturing Integrated Photonics (AIM Photonics) and Analog Photonics (AP) has released its AP SUNY Process Design Kit v2.5a (APSUNY_PDKv2.5a).
MACOM showcased its first complete chipset solution for 200G and 400G CWDM optical module providers servicing cloud data centre applications, at this year’s ECOC. It is designed to enable 200G modules at under 4.5W, and 400G modules at under 9W total power consumption, with a fully analogue architecture to ensure low latency and lower cost.
Coriant has introduced the Coriant Vibe X90 Programmable Packet Platform – the first in its Vibe series of carrier-class white boxes – designed to enable cost-efficient service aggregation from access to the core.
Described as a ‘key enabler’ of Coriant’s Hyperscale Carrier Architecture, the Vibe series will be able to provide the foundation for a disaggregated open networking solution or be added to a COTS white box-based disaggregated networking solution to enable/enhance specific network applications.
Optelian has introduced the MPX-9103 100G hardened (OSP compliant) muxponder, which is designed for 5G upgrades, remote business services access and fibre deep architectures where 10G service growth is paramount.
MACOM has introduced the MAOT-025402 CWDM4 transmitter optical sub-assembly as a part of its laser-integrated silicon photonic integrated circuit (L-PIC) solution for 100Gb/s CWDM4.
Cost and compatibility can make a compelling case for pushing 100Gb/s bandwidth over a single optical channel, both as individual links and supporting 400Gb/s Ethernet, finds Andy Extance
Robin Mersh takes a look at how the industry is creating next-generation optical access fit for 5G
Technological advances to aid the increasing demand for bandwidth, on the path towards the terabit network, should lead to optical signals that are flexible and adaptive, like water, argues Dr Maxim Kuschnerov and Dr Yin Wang