Resources

This paper describes how silicon photonic (SiPh) opto-electronic integration and packaging, with its improved RF performance, is designed to enable next-generation coherent transmission beyond 100Gbaud and provide network operators with the ability to av

Enterprise network customers and vendors - in fact, the entire data communications industry - benefit from interoperable, multivendor industry standards developed by the interaction and coordination between Telecommunications Industry Association (TIA) and International Electrotechnical Commission (IEC) component/fiber standards, American National Standards Institute (ANSI)/TIA and International Organization for Standardization (ISO)/IEC structured cabling standards and Institute of Electrical and Electronics Engineers (IEEE) Ethernet and InterNational Committee for Information Technology Standards (INCITS) Fibre Channel application standards.