Three industry leaders have entered a strategic development agreement to scale the supply chain for Very Small Form Factor (VSFF) optical connectivity, targeting the 3x density requirements of next-generation AI and hyperscale clusters.
Expanding the MMC and TMT ferrule ecosystem
Sanwa Technologies, Hakusan, and US Conec have announced a three-way multi-source agreement covering MMC connectors and TMT ferrule solutions. The deal is designed to ensure a robust, multi-vendor supply chain for high-density optical interfaces as the industry transitions away from traditional MPO cabling.
Under the terms of the agreement, Sanwa Technologies will expand its VSFF portfolio to include the MMC multi-fibre connector alongside its existing MDC duplex solutions. Hakusan will leverage its 35-year history in MT ferrule precision to manufacture the TMT ferrule in 12-fibre and 16-fibre variants.
US Conec, the original developer of the MMC platform, provides the licensing and product management framework to ensure intermateability across the ecosystem.
Driving density in AI and co-packaged optics
The partnership arrives as hyperscale operators move toward 800G and 1.6T architectures that demand significantly higher port density. The MMC platform offers up to 3x the cabling density of the standard MPO format, a critical requirement for 51.2T switching and emerging GPU-to-GPU "scale-up" fabrics.
Beyond simple density, the MMC’s TMT ferrule technology supports the low-loss performance (IEC Grade B) necessary for the tighter optical power budgets of AI training clusters and co-packaged optics (CPO). By moving the supply from a single-source to a multi-source model, the partners aim to provide the manufacturing scale required for fleet-wide deployments.
Industry leaders commit to supply capacity
Aki Ishikawa, COO at Sanwa Technologies, says that the inclusion of Hakusan’s low-loss multi-fibre ferrule expertise will "rapidly expand supply capacity" to meet market demand. Ryu Kimbara of Hakusan adds that the partnership reflects a dedication to providing reliable, high-density solutions for evolving data centre needs.
Mike Hughes, VP of Product Management at US Conec, emphasises the importance of proven support: "Both Sanwa and Hakusan have long histories of connector component supply, which will help ensure that market needs for MMC are soundly met."
Technology showcase at OFC 2026
The combined MMC ecosystem will be a focal point at OFC 2026 in Los Angeles (17–19 March). Attendees can view the latest VSFF developments at the following South Hall locations:
US Conec: Booth 1938
Sanwa Technologies: Booth 1017
Hakusan: Booth 309
