MRSI Systems

PRODUCT

MRSI Systems' MRSI-HVM3 Die Bonder enters volume production

MRSI Systems’ recently launched MRSI-HVM3 die bonder system has entered a volume production phase, using advanced demand flow technology to satisfy worldwide customer demand.

Launched at the China International Optoelectronics Exposition (CIOE) in September last year, the first wave of configured machines was focused on Chip-on-Submount (CoS), Chip-on-Carrier (CoC), and Chip-on-Baseplate (CoB) and have been successfully installed in North America, Europe and Asia.

Feature

As data demand ramps ever higher, researchers are looking to innovative amplifier designs to help transport a broader light spectrum through optical fibres, finds Andy Extance

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Duncan Ellis shares his views about the increased focus on automation from network operators, and how the physical layer has so far stubbornly resisted the move

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Switching off copper networks where fibre has been deployed is the end game, so why are so few operators doing it, wonders Pauline Rigby

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With demand for fibre to the premises increasing, Keely Portway looks at the role training plays in ensuring installation skills remain available to meet this growing demand

Analysis and opinion