MRSI Systems' MRSI-HVM3 Die Bonder enters volume production
9 March 2018
MRSI Systems’ recently launched MRSI-HVM3 die bonder system has entered a volume production phase, using advanced demand flow technology to satisfy worldwide customer demand.
Launched at the China International Optoelectronics Exposition (CIOE) in September last year, the first wave of configured machines was focused on Chip-on-Submount (CoS), Chip-on-Carrier (CoC), and Chip-on-Baseplate (CoB) and have been successfully installed in North America, Europe and Asia.
