MRSI Systems

PRODUCT

MRSI Systems' MRSI-HVM3 Die Bonder enters volume production

MRSI Systems’ recently launched MRSI-HVM3 die bonder system has entered a volume production phase, using advanced demand flow technology to satisfy worldwide customer demand.

Launched at the China International Optoelectronics Exposition (CIOE) in September last year, the first wave of configured machines was focused on Chip-on-Submount (CoS), Chip-on-Carrier (CoC), and Chip-on-Baseplate (CoB) and have been successfully installed in North America, Europe and Asia.

Feature

Cost and compatibility can make a compelling case for pushing 100Gb/s bandwidth over a single optical channel, both as individual links and supporting 400Gb/s Ethernet, finds Andy Extance

Analysis and opinion
Analysis and opinion
Feature

Robin Mersh takes a look at how the industry is creating next-generation optical access fit for 5G

Feature

Technological advances to aid the increasing demand for bandwidth, on the path towards the terabit network, should lead to optical signals that are flexible and adaptive, like water, argues Dr Maxim Kuschnerov and Dr Yin Wang