Enabling on-board and co-packaged optics requires photonic integrated circuits and silicon photonics, but the exact format is yet to be established, finds Andy Extance
Rockley Photonics has developed an in-package-optics platform, which it demonstrated to select customers and development partners at this year’s OFC.
Rockley Photonics has developed what it says is the world’s first single-chip L3 routing switch to directly integrate 100G network ports using single-mode fibre, and is now demonstrating its in-package optics platform to select customers and development partners.
Rockley Photonics has raised $40 million in its most recent round of funding, taking its total raised since its launch to $100 million. The company says that this will rapidly expand the design and production of its platform for high performance optical networking solutions, imaging and sensor photonics, and custom photonics for consumer applications.
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