Schott has expanded its portfolio of high-performance TO packages to suit high-frequency, actively cooled applications. The new TEC TO package is ideal for 10G laser diodes that require a thermoelectric cooler (TEC), enabling its use in middle to long distance telecom and datacom applications at 10Gb/s data rates.
Hermetic packaging like the transistor outline (TO) can is important for high-performance devices because it protects electronic chips from the effects of humidity as well as heat fluctuation. If humidity level is high, water condensation can cause corrosion of the semiconductor metallisation. Humidity can also cause semiconductor elements to degrade leading to the failure of the entire unit.
When designing a TO package for high-frequency applications, impedance matching and space constraints pose the largest challenge to the developer. Schott says it has overcome these limitations with the new TEC TO design. Since the new package is based on a TO footprint, it is smaller than conventional box packages.
“Box packages have a natural mechanical limitation in size reduction,” said Kenneth Tan, research and development manager at Schott Electronic Packaging in Singapore. “With TOs, a familiar face in the industry, the glass ceiling of miniaturisation is broken. Having overcome the challenges of meeting all of our customers’ requirements in one TO package, we now offer an economical alternative to the conventional box solutions.”
The inclusion of the thermoelectric cooler allows controlled heat dissipation, which leads to regulated and stable laser wavelengths. The new design is also based on an extended RF feedthrough, which uses shortened wire-bonds to minimise signal losses to the laser diode and improve the overall performance. In addition, the new TEC TO package design is based on a well-conducting steel platform.
The product is currently available to customers for qualification. It is suitable for various TEC sizes. Options for further improved heat dissipation are also available.
In addition to its standard portfolio, Schott offers customised TEC TO packages. “For us, the TEC TO header is not just a product, it underscores our research and development capability in this domain of high-frequency applications,” said Tan.
Schott is showcasing its new TEC TO package at OFC 2015 on 24-26 March in Los Angeles (booth #1317).