PRODUCT

Molex circuit assemblies employ DuPont Pyralux TK

Molex has introduced new high-speed low-loss flex circuit assemblies, developed using DuPont Pyralux TK flexible circuit material. The assemblies are ideal for electronic data transmission applications such as servers and high-end computing, storage servers and signal processing, the company says.

“Routing signals within densely packaged datacom, telecommunications, aerospace and defence equipment can be challenging,” said Greg Kuchuris, marketing manager, Molex. “As surging data transmission demands push system speeds higher, advanced materials become more critical. Our high-speed low-loss flex circuit assemblies utilise leading-edge technologies from DuPont Circuit & Packaging Materials and Molex to bring customers a unique high-performance solution, with superior signal integrity in digital and high frequency flexible circuit applications.”

Molex says it is one of the first manufacturers to incorporate DuPont Pyralux TK flexible circuit material into the volume production of multi-layer flexible circuit constructions. Pyralux TK is a double-sided flexible copper-clad laminate and bonding film system formulated with DuPont Teflon fluoropolymer film and DuPont Kapton polyimide film.

The dielectric constant and low-loss capabilities of Pyralux TK provides exceptional electrical performance for high-speed digital and high-frequency flexible circuit applications. At the same time, it delivers a mechanically flexible construction, tighter bend radii and faster transmission than standard flexible assemblies. 

“Molex and DuPont have collaborated closely to integrate Pyralux TK into the volume production of the new Molex high-speed low-loss flexible circuit assemblies, with exceptional results,” said Prasanna Srinivasan, market development leader, DuPont Circuit & Packaging Materials. “Signal loss can be minimised, which allows increased speeds and design flexibility.”

Molex high-speed low-loss flex circuit assemblies are available with self-coiling or mechanically-assisted coiling, offering options for flexible three-dimensional packaging while minimising insertion loss and providing improved airflow compared to a standard printed circuit board design.

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