Ranovus Odin architecture launched to help reduce costs for hyperscalers
This year’s OFC event saw Ranovus introduce the Odin analog-drive CPO 2.0 architecture.
Co-packaged optics can provide nx100Gbps PAM4 Optical I/O for Ethernet switch and ML/AI silicon in a single packaged assembly, which significantly reduces the cost and power consumption of the complete system.
With data center traffic growing at an unprecedented pace, fueled by advances in AI and Machine Learning, the networking infrastructure must scale in capacity while maintaining its total power consumption and footprint. Ranovus announced in March 2020 its first generation of co-packaged optics (CPO 1.0), which enabled an attractive multi-sourced solution for 51.2T Ethernet switch applications.
CPO 2.0 improves on CPO 1.0 while maintaining optical interoperability. It eliminates the retimer function in the Odin analog-drive optical engine and enables a cost-effective single die solution with the optical engine. It has a smaller footprint and allow the reuse and Optimisation of existing 100G PAM4 and PCIe Ser/Des chips vs new investment in an XSR Ser/Des chip for data centre applications
Customer trials are planned in the fourth quarter of this year.