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Molex has launched the VITA 66.1, a ruggedised optical MT backplane interconnect for high-density aerospace, defence, and commercial embedded system applications.Fully compliant with the ANSI-ratified 66.1 specification, the compact VITA 66.1 optical MT backplane provides VPX system engineers with simplicity in design and functionality for harsh environments.
'Defence and commercial applications rely on strict VPX compliance for demanding embedded-computing systems.Equipment with smaller chassis and boards needs to be easily accessible for field serviceability,' according to Mark Matus, global product manager for rugged interconnects at Molex.'Based on our innovative MT ferrule-carrier design, the VITA 66.1 interconnects reduce installation and maintenance time, plus associated costs, by enabling field servicing without requiring hand tools even in densely populated systems.'
The new Molex interconnect meets the defined requirements outlined by VITA 66.0 for blind-mate fibre-optic interconnects used with VITA 46 backplanes and plug-in modules.Available with 8, 12, or 24 fibres in standard singlemode or multimode and VersaBeam (expanded beam) MT ferrule options for design flexibility, the VITA 66.1 interconnect features a robust aluminium housing to withstand extreme temperature ranges (-50 to +105 °C), as well as shock and vibration environments.The anodised aluminium-basedhousings provide a rugged solution for use in the designated VPX card space as determined by the standard, or can be used as a stand-alone solution outside of the VPX architecture.