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MACOM L-PIC-enabled solutions for CWDM4 to drive cloud data centres and 5G optical connectivity

MACOM has introduced the MAOT-025402 CWDM4 transmitter optical sub-assembly as a part of its laser-integrated silicon photonic integrated circuit (L-PIC) solution for 100Gb/s CWDM4.

The MAOT-025402 is designed to mate with the MASC-37053A CDR to form the complete high-speed transmit path for QSFP28 CWDM4 solutions. As the explosive growth of data traffic and insatiable demand forces cloud data centres to scale capabilities quickly, the company is ready for the transition from 100Gb/s to 400Gb/s and from 4G to 5G with a highly integrated interconnect chipset solution for CWDM4, scalable to FR4 and FR1/DR1 applications.

Core to the MAOT-025402 is the MAOP-L284CN L-PIC device, which integrates four high-performance 25Gb/s CWDM wavelengths in a single silicon photonic integrated circuit (PIC) to communicate 100Gb/s over duplex single mode fibre. The company’s L-PIC platform provides a highly integrated silicon photonic solution targeting specific data centre applications that includes four CW lasers, monitor photodiodes, high bandwidth waveguides, modulators and multiplexers. Using its patented self-aligning etched facet technology (SAEFTTM) for precision attachment of the lasers to the silicon chip, MACOM’s L-PIC platform negates the need for active laser alignment and the company says it significant cost reductions to the customer, enabling mainstream deployment.

Vivek Rajgarhia, senior vice president and general manager, lightwave, at MACOM commented: ‘MACOM is leveraging our L-PIC platforms to enable leading scalability that meets the rapidly increasing CWDM4 module demand. The platform’s automated self-aligning calibration and firmware control is anticipated to deliver the requisite combination of scale and cost for mainstream cloud data centre deployment.’

MACOM’s L-PIC platform delivers leading bandwidth critical to enabling CWDM4, and is now available in transmitter optical subassembly (TOSA) and at die level. Each product includes a companion matched driver and PIC controller. Leveraging this three device chipset, customers are able to significantly reduce engineering risk and achieve faster time-to-market. The accompanying software provides automatic calibration and self-test capabilities, and significantly reduces customers’ capital investment required for production lines.



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