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AIM Photonics unveils new silicon photonics process design kit

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The American Institute for Manufacturing Integrated Photonics (AIM Photonics) and Analog Photonics (AP) has released its AP SUNY Process Design Kit v2.5a (APSUNY_PDKv2.5a).

In this latest version, AP expanded the set of silicon photonics integrated circuit (PIC) component libraries within SUNY Poly’s process capabilities to address the needs for O+C+L band applications. Combined with Multi-Project Wafer (MPW) runs, this updated PDK will give the company’s members access to silicon photonics components for the development of optical transceivers or systems used in all levels within data centres and high-performance computers.

The silicon photonics PDK includes design guide, design rule check deck, technology files, active and passive component documentation, abstracts, schematics, and compact models for the development of PICs. Key features include O Band modulation, detection and coupling support; C+L Band modulation, detection, filtering, switching, monitoring and coupling support; single and multi-level modulation format support at 50Gb/s, namely NRZ and PAM-4; continued multi-vendor electronics-photonics-design-automation (EPDA) support with integrated EPDA PDK flow for hierarchical design and system-level simulation.

In the near future, the PDK will be empowered by laser and CMOS integration with an interposer – a capability that will be made possible at AIM Photonics’ test, assembly, and packaging facility, located in Rochester, NY. Additional releases of the AP SUNY Process Design Kit are planned over the next several years each quarter, with improved statistical models, optical components, and PIC systems.