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AIM Photonics, AP release AP SUNY Design Kit v2.0a

The American Institute for Manufacturing Integrated Photonics (AIM Photonics) and Analog Photonics (AP) have released the AP SUNY Process Design Kit v2.0a.

The new kit sees AP expand the comprehensive set of silicon photonic integrated circuit (PIC) component libraries within SUNY Poly’s process to address the high-speed optical communication needs. Combined with multi-project wafer (MPW) runs, the kit is designed to give AIM Photonics’ members access to high quality silicon photonics components for the development of 100, 200 and 400G+ optical transceivers or systems used in data centres, metro and long haul optical networks. It includes a silicon photonics library of interfaces, passive, and active components, schematics and models for the development of optical modules and system.  

The kit features 50Gb/s modulation, with less than one-volt peak to peak drive. Digital detectors with greater than 45GHz bandwidth and high responsivity, meanwhile, make it a useful option for C-band receivers. Polarisation support for standard and low-cost single mode fibres, eliminate the need for expensive polarisation maintaining fibres, whilst lower loss crossings, propagation with seamless dielectric transitions and less than 1 per cent mismatch between the outputs of a 3dB splitter, lead to a high common mode rejection ratio (CMRR).

The combined AP SUNY PDKv2.0a and MPW offering is designed to provide unmatched access to PIC systems for companies that desire a reduction in the time to market, product development risk, and investment. By incorporating the design, verification, and process development within the kit, companies can rapidly modify their designs while reducing the cost per gigabit. 

In the near future, the design kit will be empowered by laser and CMOS integration with an interposer, a capability that will be made possible at AIM Photonics’ test, assembly, and packaging facility, located in Rochester, NY. Additional releases of the AP SUNY Process Design Kit are planned over the next several years with improved statistical models, optical components, and PIC systems.


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