TE Connectivity

Connectivity and sensor specialist TE Connectivity has launched a new line of micro quad small form-factor pluggable (microQSFP) connectors and cages for the next generation of pluggable optical interconnects.

MicroQSFP interconnects can help solve key challenges relating to bandwidth, thermal performance and energy costs in data centres as data rates go ever higher.

TE Connectivity (TE) has introduced the new Osmium high-density fibre-optic chassis specifically designed to decrease the required number of racks deployed in data centres, resulting in reduced floor space usage and associated cost savings. The Osmium high-density fibre-optic chassis offers up to 45 per cent improvement in density for LC ports per rack unit compared to the nearest market equivalent, offering 210 LC ports compared to 144 LC ports.

TE Connectivity has expanded its Quareo family of physical layer management (PLM) systems with additional products featuring connection point identification (CPID) technology. The new Quareo-enabled platforms include the QNG4 optical distribution frame and QHDEP equipment panel.

TE Connectivity will showcase two new connectors at booth 1417 during OFC 2015 in Los Angeles, California, on 24-26 March. The FullAXS Mini connector sealing system and cable assemblies are designed to reduce installation costs in wireless tower applications. In addition, TE is introducing its next-generation MXC optical connector, which increases front panel density by 40 per cent.

TE Connectivity has introduced its new micro SFP+ connector and cable assembly, which slashes space requirements on faceplates and printed circuit boards (PCBs) in telecom, datacom, networking and medical diagnostic equipment.

The new micro SFP+ connector and cable assembly are up to 50 per cent smaller in width and length than current SFP+ interconnects, enabling denser equipment designs than before.

At the FTTH Conference 2015 in Warsaw TE launched its FACT optical distribution frame (ODF) system.

The FACT system is designed to enable faster and easier installation in a high-density environment, the vendor says.

The tool-less system has a high level of modularity to guarantee easy migration to new connectivity platforms and expansion within existing central office sites.

In central office or point-of-presence applications, FACT meets all the requirements for a high-density, manageable system, including: