Multi-vendor interoperability demonstrated at ECOC 2022
OIF, the industry’s optical internetworking forum hosted its largest global interoperability showcase at ECOC 2022.
Visitors to OIF’s booth were able to see almost 30 member companies participate in demonstrations in four critical areas: 400ZR optics, co-packaging architectures, common electrical I/O (CEI) architectures and common management interface specification (CMIS) implementations.
The interoperable optical networking solutions demo—live and static— featured participants including: Alphawave IP; Amphenol; Applied Optoelectronics; Cadence Design Systems; Ciena; Cisco; Corning; Credo; Exfo; Fujitsu Optical Components; Juniper Networks; Keysight Technologies; Lumentum; Marvell; MaxLinear; Microchip Technology; Molex; MultiLane; Nokia; O-Net Communications; Senko Advanced Components; Sumitomo Electric Industries; Synopsys; TE Connectivity; US Conec; Viavi Solutions; Wilder Technologies and Yamaichi Electronics.
The 400ZR interop demo showed a full implementation across an 80km DWDM ecosystem using multiple form-factor pluggable modules, 400GbE routers, a 75 GHz C-band open line system, and test equipment solutions from multiple vendors. The demo provides evidence of widescale 400ZR deployment readiness based on a broad ecosystem of interoperable solutions.
The co-packaging demo featured multi-party demonstrations of OIF’s 3.2T Module project and External Laser Small Form Factor Pluggable project (ELSFP). A variety of interoperable components that enable co-packaging will be shown, along with a system implementation. The CEI-112G demonstrations will feature multi-party silicon supplier interoperability over various channels, including mated compliance boards, PCB channels, direct attach copper cable channels, a cabled backplane and even fibre. Each configuration demonstrates the technical viability of 112Gb/s operation, along with multiple industry form factors, including OSFP and QSFP-DD. OIF is also leading the charge on 224G hardware interconnection application spaces and definitions, unveiling publicly at ECOC the first live 224G demo.
The CMIS demo consisted of four separate demonstrations that showed how modules can be managed and initialised, how modules can support multiple independent services (breakout) and how module firmware can be easily upgraded.
Mike Klempa, Alphawave IP Group, and OIF Physical & Link Layer Interoperability Working Group chair says: ‘The high level of participation in this year’s interoperability demonstration at ECOC demonstrates the global importance of OIF’s work and the collective efforts of its members to showcase how their solutions establish an ecosystem and work together to drive implementation of next-generation capabilities.’